Auster 隨手亂彈

Here are my recommendations for the largest 0402 (1005) chip capacitor land pattern and it's in the IPC-7351 Nominal environment. I also rounded the corners to reduce the paste mask volume and I would also thin the paste mask stencil to reduce the paste mask volume. However, you can use the "Least" environment dimensions with good results.

We had a meeting with IPC-7351 committee last week and we adjusted the "TOE" solder joint goal for parts less than 1.6 mm length. So I have to delete the comment about using only Nominal dimensions for the component terminal because we fixed that in the IPC Calculator in the V2014.11 release.

Here is the new solder joint goal chart for chip components. These new values for miniature parts will eliminate tombstoning issues and provide the best paste volume for the assembly process.